Services

Testing

Underground Utility Locating

Private Locates

As part of our private utility locate, we provide the horizontal locations of existing private detectable buried utilities and structures.

Our services for this task include:
Documentation Review including public locates, surveys, as-built or constructions drawings and property investigation which includes:

  • work area and property boundaries
  • property grounds
  • building mechanical and service utility rooms
  • points of demarcation to identify which utilities are public and which are private.

Dynamic Power Systems will use various active, passive and inductive locate methods to physically locate the horizontal location of private detectable buried utilities and mark them with the international colour codes for marking.

We prepare a private utility locate report that will include a site sketch of all utilities marked. This locate report will also note any limitations or special concerns found during the locate.

Tracer Wire Verification

Tracer wire is installed as a method of locating plastic piping after it has been placed into the ground. Correct installation of the tracer wire is a must in order for it to fulfill its purpose.
Don’t get caught years down the road after installation to find out that the tracer wire does not tone. Dynamic Power Systems Locates can work with you to verify that the tracer wire was installed correcting according the specifications provided to your contractor.

Site Utility Mapping

Many property owners have little or no idea of what utilities are buried on their property.
Dynamic Power Systems Locates can work with property owners and survey companies to create a site facility map showing the horizontal locations of these buried utilities.


Thermal Imaging

Inspecting Electrical Components Using Infrared (IR) Thermal Imaging

Infrared (IR) thermal imaging has been used to inspect electrical systems for some time now and its use has steadily grown increasingly popular. Since components in electrical systems almost always overheat before they fail, problem areas are more easily and safely found when viewed through an infrared (IR) thermal imaging camera. During an inspection, electrical equipment, such as distribution panel boards, switch boards, contacts, transformers, receptacles, and service and control panels, can be examined through an infrared (IR) thermal imaging camera. By viewing apparent temperature differences, we are able to identify and document problems, such as loose connections and overloaded circuits, which are the most common causes of electrical fires.

Because viewing apparent temperature differences through an infrared (IR) thermal imaging camera requires no physical contact and can cover a lot of space in one sweep, no other technology allows electrical faults to be found as safely and as quickly as infrared (IR) thermal imaging.

Infrared (IR) thermal imaging cameras are commonly used for inspections of electrical systems and components in all sizes and shapes. The multitude of possible applications for infrared (IR) thermal imaging cameras within the range of electrical systems can be divided into two categories: high voltage and low voltage installations.

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Detect High-Voltage Failures

In high voltage installations heat is an important factor. When electrical current passes through a resistive element, it generates heat. An increased resistance results in an increase in heat. Over time the resistance of electrical connections will increase, due to loosening and corrosion for instance. The corresponding rise in temperature can cause components to fail, resulting in unplanned outages and even injuries. In addition, the energy spent on generating heat causes unnecessary energy losses. If left unchecked, the heat can even rise to the point where connections melt and break down; as a result, fires may break out. Examples of failures in high-voltage installations that can be detected with infrared (IR) thermal imaging:

  • Oxidation of High Voltage Switches
  • Overheated Connections
  • Incorrectly Secured Connections
  • Insulator Defects

These and other issues can be spotted at an early stage with an infrared (IR) thermal imaging camera. An infrared (IR) thermal imaging camera will help to accurately locate the problem, determine the severity of the problem, and establish the time frame in which the equipment should be repaired.

One of the many advantages of infrared (IR) thermal imaging is the ability to perform inspections while electrical systems are under load. Since infrared (IR) thermal imaging is a non-contact diagnostic method, an infrared (IR) thermographer can quickly scan a particular piece of equipment from a safe distance, leave the hazardous area, return to his office and analyze the data without ever putting himself in harm’s way.

Detect Low-Voltage Failures

Infrared (IR) thermal imaging cameras are used for inspections of electrical systems and components in all sizes and shapes and their use is by no means limited to large high voltage applications alone. Electrical cabinets and motor control centers are regularly scanned with an infrared (IR) thermal imaging camera. If left unchecked, heat can rise to a point that connections melt and break down; as a result, fires may break out. Besides loose connections, electrical systems suffer from load imbalances, corrosion, and increases in impedance to current. Infrared (IR) thermal inspections can quickly locate hot spots, determine the severity of the problem, and help establish the time frame in which the equipment should be repaired. Examples of failures in low voltage equipment that can be detected with infrared (IR) thermal imaging:

  • High Resistance Connections
  • Corroded Connections
  • Poor Connections
  • Internal Fuse Damage
  • Internal Circuit Breaker Faults
  • Internal Damage

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These and other issues can be spotted at an early stage with an infrared (IR) thermal imaging camera. This will help to prevent costly damages and to avoid dangerous situations.


Insulation Resistance

Insulation starts to age as soon as it’s made. As it ages, its insulating performance deteriorates. Any harsh installation environments, especially those with temperature extremes and/or chemical contamination, accelerates this process. This deterioration can result in dangerous conditions in power reliability and personnel safety. As such, it’s important to identify this deterioration quickly so that corrective steps can be taken.

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Polaization Index (PI)

PI was developed to make interpretation of results less sensitive to temperature. PI is the ratio of two IR at two different times. Temperature of the winding does not rise during the test period of 10 minutes. So it is fairly assumed that both R10 and R1 are measured at same winding temperature. Then the temperature correction factor will be same for both cases and will be cancelled during the calculation of Pl. Thus PI is relatively insensitive to temperature. Further in the formula of PI, the polarization current is used as a ‘yard stick’ to see if the leakage and conduction currents are excessive. If these later currents are much larger than the polarization current, the ratio will be about one. It is known from the experience that, if PI is about one, leakage and conduction currents are large enough that electrical tracking will occur. Conversely, if the leakage and conduction current are low compared to polarization currents, PI will be greater than 2, and experience shows that electrical tracking problems are unlikely. Thus during test, if we see the decay in the total current or rise in the IR in the interval between 1 minute and 10 minutes, then this must be due to polarization current ( since the leakage and conduction currents are constant with time) which implies that the leakage and conduction currents are low.

Dielectric absorbtion ratio (DAR)

DAR measurement is a diagnostic test similar to the Polarization Index (PI), but DAR takes the ratio of the Insulation Resistance usually measured at 30 sec and 1 min (other time settings are possible) instead of 1 min and 10 min typically of the PI.

DAR measurements are useful for instance when the PI is 2 or less even for new objects under test. In such cases, a min DAR value of 1.25 is required.

All of our test results results are data logged and provided in a report to the client.


Ground Resistance

Proper wiring and good grounds can eliminate many power quality problems. Also important is the bonding to the ground system. Testing grounds and bonding should be an active part of any power quality troubleshooting strategy. One effective time-saving method is to use a clamp-on ground tester.

Resistance Tester

To verify the grounding resistance, the operator simply clamps the sensor around the connection at the ground rod and reads the resistance on the display of the instrument. It is that simple. This method offers several distinct advantages over the commonly used fall-of-potential method. First, you do not have to disconnect the ground rod from the system, which eliminates a potential safety hazard. Secondly, no auxiliary rods need to be driven which saves time and money. Thirdly, this test method includes the bonding and overall connecting resistance, which is not available with other methods. An additional benefit is the ability to measure leakage current flowing through the grounding system.

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